HP-DK70M Mikrofon Array Module- Fornitore global

2nd floor, Yubao Industrial Park, 17 Xiangshan Road, Science City, Huangpu Development Zone, Guangzhou

I. Bayan
Në ɣän juëc yiic, kɔɔr ye bɛ̈n ɣän bɛɛ̈ɛ̈i yiic, ku ye kɔɔr ye kɔɔr ye kɔɔr ye kɔɔr ye kɔɔr ye kɔɔr ye kɔɔr ye kɔɔr ye kɔɔr ye kɔɔr ye kɔɔr ye kɔɔr ye kɔɔr ye kɔɔr ye kɔɔr ye kɔ Microphone Array Module (HP-DK70M) Guangzhou Sicheng Electronics Co., Ltd. ye looi në 4 silicon corn (MEMS) microphone round array technology design and development of single-point microphone module, product kënë ee luui në 4 microphone array, integrating noise suppression, echo suppression, echo elimination, fixed beam and other algorithms, in a noisy field environment can effectively extract the speaker's voice, reducing the surrounding environment noise interference. Në ye mɛn, a tɔ̈u në wɛ̈t juëc de wɛ̈t de wɛ̈t de wɛ̈t de wɛ̈t de wɛ̈t de wɛ̈t de wɛ̈t de wɛ̈t de wɛ̈t de wɛ̈t de wɛ̈

Foto 1

II. Sistem Framework
HP-DK70M ye luui në ye mɛn ye cɔl four-grain array, ye UAC2.0 audio protocol kony. A tõe Windows, Linux, Android, etc. kony

3. Module size
1. Dɛ̈ɛ̈r dɛ̈ɛ̈r 80.5mm * 49mm * 1.6mm.

Data transfer protocol: USB 2.0.

4. Akustik ku Elektrik Parameters

Tabel 1 Parameters akustik

Parameters	Indikator
Orientation	Single pointer
Sensitivity	-38dB @1V/Pa 1kHz
Distance of pick-up	≤5m
Frequency Response	20~20KHz±3dB
Signal noise ratio	65dB@1KHz at 1Pa
Frequency sampling	16kHz
Kuantitate bit	16bit
Dynamic Range	104dB (1KHz at Max dB SPL)
Maximum pressure de son	123dB SPL（1KHz,THD=1%）
Signal Processing	BEFORMING beam form; Wurtin jam; AEC echo elimination; AI bɛ̈ɛ̈i bɛ̈ɛ̈i; Dɛ̈ɛ̈r Dɛ̈ɛ̈r Dɛ̈ɛ̈r Dɛ̈ɛ̈r Dɛ̈ɛ̈r

Tabel 2 Parameters Elektrik

Nyuɔ	Indikator
Voltage Power	5V
Data Interface	Type-C Interface
Protokoll Transfer	USB 2.0
Power consumption ye dɔɔni	200mW
Temperature de luɔi	-25 °C to 75 °C
Temperature ye tɔ̈ɔ̈u	-40 °C to 100 °C

5. Dɛɛ̈ɛ̈r dɛ̈ɛ̈r dɛ̈ɛ̈r dɛ̈ɛ̈r dɛ̈ɛ̈r dɛ̈ɛ̈r
Lɔ̈ɔ̈m de wɛ̈ɛ̈r: HP-DK70M ee luui në microphone de wɛ̈ɛ̈r de wɛ̈ɛ̈r de wɛ̈ɛ̈r de wɛ̈ɛ̈r de wɛ̈ɛ̈r de wɛ̈ɛ̈r de wɛ

Figure 3 Dɔŋ dɔŋ dɔŋ dɔŋ dɔŋ dɔŋ dɔŋ dɔŋ dɔŋ dɔŋ dɔŋ dɔŋ dɔŋ dɔŋ

Dɛ̈ɛ̈r: Dɛ̈ɛ̈r dɛ̈ɛ̈r dɛ̈ɛ̈r dɛ̈ɛ̈r dɛ̈ɛ̈r dɛ̈ɛ̈r dɛ̈ɛ̈r

Lɔ̈ɔ̈i: Lɔ̈ɔ̈i ye ±45°, lɔ̈ɔ̈i ye 25°, lɔ̈ɔ̈i ye ±45°, lɔ̈ɔ̈i ye ±45°, lɔ̈ɔ̈i ye ±45°.

Polarity suppression: Polarity graph ye tɛmɛ në 1KHz frequency ye nyuɔɔth në Figure 6 ye tɔ̈u piny, në wɛbthail de pick-up range ye reference range, pick-up real has a certain attenuation transition phase.

6. Interface definition
HP-DK70M module interface ye tɔ̈u në Type C, PCBA ye nyuɔɔth:

Diagram 7 PCBA

7. Hardware Configuration and List
Hardware design ye modular design principle ye luɔ̈ɔ̈i, a thiin koor. Motherboard ye dɛmɛ bɛ̈ɛ̈i juëc ye dɛmɛ bɛ̈ɛ̈i ye dɛmɛ bɛ̈ɛ̈i ye dɛmɛ bɛ̈ɛ̈i ye dɛmɛ bɛ̈ɛ̈i ye dɛmɛ b Lɔnadɛ̈ ye hardware configure tɔ̈u Table 5-1, ku lɔnadɛ̈ ye hardware list tɔ̈u Table 5-2.

Tabel 5-1 Lɛt ye hardware looi

Serial No	Nyuɔ	Bayan
1	Sistem	Sistem Linux
2	Memori	128MB DDR3+128MB FLASH
3	cpu	ARM@ A7, Dual Core, 1.2GHZ Main Frequency

Tabel 5-2 Listi hardware

Serial No	Nyuɔ	Bayan
1	MB_V1.0	Motherboard, run algorithms, output algorithms after processing audio

8. Luɔi
1, të cenë yen tɔ̈ɔ̈u thïn, a wïc ba tɛ̈n yenë yen tɔ̈ɔ̈u thïn ya tɔ̈ɔ̈u thïn ya tɔ̈ɔ̈u thïn ya tɔ̈ɔ̈u thïn.
2, dɔ̈ɔ̈r dɔ̈ɔ̈r dɔ̈ɔ̈r dɔ̈ɔ̈r dɔ̈ɔ̈r dɔ̈ɔ̈r dɔ̈ɔ̈r dɔ̈ɔ̈r dɔ̈ɔ̈r dɔ̈ɔ̈r dɔ̈
3.When assembled, PCBA board input sound hole surface needs to be tight to the peripheral structure inner wall, the more tight the better, so as not to form a sound cavity, at least needs: 2D> h.